Google Pixel 6 will reportedly feature in-house silicon ‘GS101’ instead of Snapdragon processor

Rumors about Google working on its system on chip (SoC) have been twirling since 2020, and today another report declares that the organization will make a big appearance its first SoC in its next flagship Pixel 6. As per documentation 9to5Google says it saw, the chipset, codenamed Whitechapel, will power pixel phones coming this fall.

Prior reports had demonstrated that Whitechapel would be an SoC for phones and Chromebooks and that Google had been working with Samsung to build up the processors. The present article from 9to5Google features an association with Samsung’s Exynos chipsets, noticing that Whitechapel “is being created with Samsung Semiconductor’s system large scale integration (SLSI) division.”

There are a few codenames called out in 9to5Google’s report, including “GS101”, which the outlet says is an interior organization moniker for the chip. 9to5Google additionally theorizes that the letters GS could represent Google Silicon. Another codename featured in this report is “Slider” which the distribution accepts as a “shared stage for the principal Whitechapel SoC.” Slider is connected to a few different ventures, including two more codenames — “Raven” and “Oriole.”

These are accepted to be impending Pixel flagships scheduled for dispatch this fall, with one of them expected to be the Pixel 6. Google declined to remark on this report when Engadget connected for affirmation. Given the organization’s history of codename use and the industrious tales around Whitechapel, this report conveys some weight.

With phone producers like Samsung, Apple, Huawei, and Xiaomi having effectively made or seeming to move to their chipsets, it’s not amazing that Google could be doing likewise. While none of this is true yet we’re still months from the normal Pixel 6 dispatch (which ordinarily occurs in October), it’s presumable we’ll keep on hearing more about this Google SoC as we move towards fall.

Update: XDA is claiming that it has seen some internal documentation about Google’s next Pixel devices hinting that “Google is working on new GS101 silicon for its 2021 Pixel phones (Pixel 6 series) with an integrated Titan M security chip (code-named Citadel).” XDA also claiming that “the GS101 will feature a 3 cluster setup with a TPU (Tensor Processing Unit).”